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VN330SP-32-E
QUAD HIGH SIDE SMART POWER SOLID STATE RELAY
General Features
Type VN330SP-32-E Vdemag(*) VCC-55V RDSon(*) Iout(*) 0.32(**) 1A VCC 36V
(*)Per channel. (**)at TJ = 85C
Features

PowerSO-10TM
OUTPUT CURRENT : 1A PER CHANNEL DIGITAL INPUT CLAMPED AT 32V MINIMUM VOLTAGE SHORTED LOAD AND OVERTEMPERATURE PROTECTIONS BUILT-IN CURRENT LIMITER UNDERVOLTAGE SHUT-DOWN OPEN DRAIN DIAGNOSTIC OUTPUT FAST DEMAGNETIZATION OF INDUCTIVE LOADS
Description
The VN330SP-32-E is a monolithic device made using STMicroelectronics VIPower Technology, intended for driving four indipendent resistive or inductive loads with one side connected to ground. Active current limitation avoids dropping the system power supply in case of shorted load. Built-in thermal shut-down protects the chip from overtemperature and short circuit. The open drain diagnostic output indicates over-temperature conditions.

Block Diagram
September 2005
Rev 3 1/14
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VN330SP-32-E
Table 1.
Symbol VCC -VCC IOUT IR IIN IDIAG VESD EAS Ptot TJ Tstg Power supply voltage Reverse supply voltage Output current (continuos) Reverse output current (per channel) Input current (per channel) Diag pin current Electrostatic discharge (R = 1.5KW; C = 100pF) Single pulse avalanche energy per channel not simultaneously Figure 3. Power dissipation at Tc <= 25C Junction operating temperature Storage Temperature
Absolute Maximum Rating
Parameter Value 45 -0.3 Internally limited -6 10 10 2000 400 Internally limited Internally limited -55 to 150 Unit V V A A mA mA V mJ W C C
Figure 1.
Connection Diagram (Top View)
Figure 2.
Current and Voltage Conventions
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Table 2.
Symbol RthJC RthJA
Thermal data
Parameter Thermal resistance junction-case (Note:1) Thermal resistance junction-ambient (Note:2) Max Max Max Value 2 50 Unit C/W C/W
Note: Note:
1.Per channel 2.When mounted using minimum recommended pad size on FR-4 board
Electrical Chracteristics (10V < V CC < 36V; -25C < TJ < 125C; unless otherwise specified)
Table 3.
Symbol VCC RON
Power Section
Parameter Supply voltage On state resistance IOUT = 0.5A; TJ = 125C IOUT = 0.5A; TJ = 85C IOUT = 0.5A; TJ = 25C All channels OFF; VIN = 30V; On state; TJ = 125C IOUT1...IOUT4 = 0V Test Conditions Min. 10 Typ. Max. 36 0.4 0.32 0.2 1 10 VCC-65 VCC-55 VCC-45 Unit V mA mA V
IS Vdemag
Supply current
Output voltage at turn-off IOUT = 0.5A; LLOAD >= 1mH
Table 4.
Symbol VIL VIH VI(HYST) IIN ILGND VICL
Logical Input
Parameter Input low level voltage Input high level voltage . Input hysteresis voltage Input current Output current in ground disconnection Input clamp voltage Note:3 VIN = 0 to 30V VIN = 0 to 2V VCC = VINn = GND = DIAG = 24V; TJ = 25C IIN = 1mA IIN = -1mA 32 36 -0.7 25 25 Note:3 3.5 0.5 600 Test Conditions Min. Typ. Max. 2 Unit V V V m V V
Note:
3.The input voltage is internally clamped at 32V minimum, it is possible to connect the input pins to an higher voltage via an external resistor calculate to not exceed 10mA
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Table 5.
Symbol
Switching ( VCC = 24V)
Parameter Test Conditions IOUT = 0.5A, Resistive Load Input rise time < 0.1s, TJ = 25C TJ = 125C Rise time of Output current IOUT = 0.5A, Resistive Load Input rise time < 0.1s, TJ = 25C TJ = 125C Turn-off delay time of Output current IOUT = 0.5A, Resistive Load Input rise time < 0.1s, TJ = 25C TJ = 125C Fall time of Output current IOUT = 0.5A, Resistive Load Input rise time < 0.1s, TJ = 25C TJ = 125C IOUT = 0.5A, IOUT = ILIM, T J = 25C IOUT = 0.5A, IOUT = ILIM, T J = 25C Min. Typ. Max. Unit
td(ON)
Turn-on delay time of Output current
30
40 60
s s
tr
50
100 115
s s
td(OFF)
20
30 40
s s
tf
8
15 20 0.5 2 2 4
s s /s /s /s /s
(di/dt)on (di/dt)off
Turn-on current slope
Turn-off current slope
Table 6.
Symbol VDIAG(*) VSCL (*) VUSD ILIM IOVPK IDIAGH ILOAD tSC TTSD TR
Protections
Parameter Test Conditions Min. Typ. Max. 1 32 36 -0.7 8 2.5 4 100 25 100 150 135 170 155 Unit V V V V A A s C C Status voltage output low IDIAG = 5mA ( Fault condition ) Status clamp voltage Undervoltage shut down DC Short circuit current Leakage on diag pin in high state Output leakage current Delay time of current limiter Thermal shut down temperature Thermal reset temperature VCC = 24V; R LOAD < 10m Peak short circuit current VCC = 24V; V IN = 30V; RLOAD < 10m VDIAG = 24V VCC = 10 to 36V; V IN = VIL 4 Channels in Parallel IDIAG = 1mA IDIAG = -1mA 5 1
(*)Status determination > 100ms after the switching edge.
Note:
If INPUT pin is floating the corrisponding channel will automatically switch OFF. If GND pin is disconnected, the channel will switch OFF provided VCC not exceed 36V.
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Figure 3. Avalance Energy Test Circuit
Figure 4.
Peak Short Circuit Test Diagram
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Table 7. Truth Table
Conditions Normal operation Overtemperature Undervoltage Shorted load ( Current limitation ) INPUTn L H L H L H L H OUTPUTn L H L L L L L H Diagnostic H H H L H H H H
Figure 5.
Switching Waveforms
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Figure 6. Switching Parameter Test Conditions
Figure 7.
Driving Circuit
PowerSO-10TM Thermal Data
Figure 8. PowerSO-10TM PC Board
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Figure 9. RthJA Vs. PBC copper area in open box free air condition
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Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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Table 8. PowerSO-10TM Mechanical Data
Figure 10. PowerSO-10TM Package Dimensions
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Figure 11. PowerSO-10TM Suggested Pad and Tube Shipment (No Suffix)
Figure 12. Tape and Reel Shipment (Suffix "TR")
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Table 9. Order Codes
Package PowerSO-10TM Tube VN330SP-32-E Tape and Reel VN330SPTR-32-E
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VN330SP-32-E
Table 10. Revision History
Date 5-Sep-2005 Revision 3 Changes Final release
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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